1. The module can be replaced at will with infinite expansion, a segmental hollow-out design, and can increase, reduce, or take out the buckle
2. One key separation and fit safety does not burst tin, intelligent temperature control does not hurt the motherboard
3. Push-pull module self-locking design; module automatically springs up when pressed
4. 30 seconds heating, 120 seconds stratification
5. Notice: only for i2C T20 motherboard heating platform(SKU:EDA0048289)
Specification:
|
General
|
| Compatible with |
Apple:
iPhone 13 Pro Max
, iPhone 13 mini
, iPhone 13 Pro
|
|
|
Package Weight
|
| One Package Weight |
0.08kgs / 0.18lb
|
| One Package Size |
20cm * 15cm * 2cm / 7.87inch * 5.91inch * 0.79inch
|
| Carton Weight |
4.68kgs / 10.32lb
|
| Carton Size |
42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch
|
| Loading Container |
20GP: 620 cartons * 60 pcs = 37200 pcs
40HQ: 1439 cartons * 60 pcs = 86340 pcs
|
|
